The general technical scope of the System Level Interconnect Prediction (SLIP)workshop is the design, analysis and prediction of intercommunication fabrics in electronic systems.
Representative technical topics include, but are not limited to,
interconnect prediction at various IC design stages, interconnect design challenges and system-level NoC design, design and analysis of power and clock networks, interconnect architecture of structural designs and FPGAs,interconnect fabrics of many-core architectures, design-for-manufacturing (DFM) techniques for interconnects, high speed PCB interconnect design, design and analysis of chip-package interfaces, interconnect topologies of multiprocessor systems,interconnect design and prediction of through-silicon vias (TSV) in 3D ICs, emerging interconnect technologies, synergies between chip intercommunication networks and networks arising in other contexts such as social networks, system biology.
